Semiconductor device socket

ABSTRACT

A socket that secures bare and minimally packaged semiconductor devices substantially perpendicularly relative to a carrier substrate. The socket includes intermediate conductive elements and a member which moves the intermediate conductive elements between an insertion position and a biased position. After placement of the intermediate conductive elements into an insertion position, a semiconductor device may be inserted into a receptacle of the socket with minimal insertion force. Movement of the member to a biased position facilitates biasing of the intermediate conductive elements against a bond pad of the semiconductor device. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate. A first embodiment of the socket includes a member which moves transversely relative to the remainder of the socket. In a second embodiment of the socket, the member moves vertically relative to the socket body.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 09/732,106,filed Dec. 7, 2000, now U.S. Pat. No. 6,442,044, issued Aug. 27, 2002,which is a continuation of application Ser. No. 09/461,992, filed Dec.15, 1999, now U.S. Pat. No. 6,198,636, issued Mar. 6, 2001, which is acontinuation of application Ser. No. 09/207,646, filed Dec. 8, 1998, nowU.S. Pat. No. 6,088,237, issued Jul. 11, 2000, which is a continuationof application Ser. No. 09/001,300, filed Dec. 31, 1997, now U.S. Pat.No. 5,995,378, issued Nov. 30, 1999.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to zero insertion force sockets whichreceive and operatively connect one or more semiconductor devices to acarrier substrate. Particularly, the present invention relates to zeroinsertion force sockets which receive bare or minimally packaged,vertically mountable semiconductor devices. The present invention alsorelates to semiconductor devices which are mountable substantiallyperpendicular relative to a carrier substrate and to devices whichsecure bare or minimally packaged semiconductor devices to a carriersubstrate.

2. Background of Related Art

Zero insertion force sockets which operatively attach packagedsemiconductor devices to a carrier substrate are known in the art.Typical zero insertion force sockets include resilient contacts whichbias against the leads of a package inserted therein. An electricalcontact is established between each of the leads and its correspondingcontact as the spring force of the contact biases the same against thelead. Exemplary zero insertion force sockets which include resilientcontacts are disclosed in the following U.S. Pat. No. 5,466,169, issuedto Kuang-Chih Lai on Nov. 14, 1995; U.S. Pat. No. 5,358,421, issued toKurt H. Petersen on Oct. 25, 1994; U.S. Pat. No. 4,889,499, issued toJerzy Sochor on Dec. 26, 1989; U.S. Pat. No. 4,710,134, issued to IosifKorunsky on Dec. 1, 1987; U.S. Pat. No. 4,527,850, issued to Clyde T.Carter on Jul. 9, 1985; U.S. Pat. No. 4,381,130, issued to George J.Sprenkle on Apr. 26, 1983; and U.S. Pat. No. 4,266,840, issued to JackSeidler on May 12, 1981.

Such devices would not be useful for securing and operatively attachingbare or minimally packaged semiconductor devices to a carrier substratesince the resilient contacts of some such devices are adapted toestablish electrical contact with the elongated leads of a packagedsemiconductor device, rather than with the bond pads of bare and manyminimally packaged semiconductor devices. Other zero insertion forcesockets in the prior art include resilient contacts which abut thesemiconductor device during insertion of the same into the socket. Thus,the friction generated by the contacts of such zero insertion forcesockets would likely scratch or otherwise damage bare semiconductordevices and many minimally packaged semiconductor devices duringinsertion therein.

Moreover, zero insertion force sockets which include resilient contactsare somewhat undesirable from the standpoint that the contacts tend tolose their resiliency over time and with frequent removal andreinsertion of devices. Thus, the ability of many such zero insertionforce socket resilient contacts to establish adequate electricalconnections with their corresponding leads of the inserted packagedsemiconductor device diminishes over time. Moreover, such resilientcontacts may also be damaged while inserting a packaged semiconductordevice into the socket.

Other zero insertion force sockets have been developed in order toovercome the above-identified shortcomings of resilient contacts. Manysuch zero insertion force sockets include contacts which are biasedagainst the leads of a packaged semiconductor device inserted therein bya laterally sliding mechanical actuation device. Examples of suchdevices are disclosed in the following U.S. Pat. No.: Reissue 28,171,issued to John W. Anhalt; U.S. Pat. No. 4,501,461 on Sep. 24, 1974,issued to John W. Anhalt on Feb. 26, 1985; U.S. Pat. No. 4,397,512issued to Michele Barraire et al. on Aug. 9, 1983; U.S. Pat. No.4,391,408, issued to Richard J. Hanlon and Rudi O. H. Vetter on Jul. 5,1983; and U.S. Pat. No. 4,314,736, issued to Eugene F. Demnianiuk onFeb. 9, 1982.

However, the contacts of many such devices are adapted to establish anelectrical connection with the leads of a packaged semiconductor devicerather than with the bond pads of a bare or minimally packagedsemiconductor device.

Vertical surface mount packages are also known in the art. When comparedwith traditional, horizontally mountable semiconductor packages andhorizontally oriented multi-chip packages, many vertical surface mountpackages have a superior ability to transfer heat. Vertical surfacemount packages also consume less area on a carrier substrate than ahorizontally mounted package of the same size. Thus, many skilledindividuals in the semiconductor industry are finding vertical surfacemount packages more desirable than their traditional, horizontallymountable counterparts.

Exemplary vertical surface mount packages are disclosed in the followingU.S. Pat. No.: Re. 34,794 (the “'794 patent”), issued to Warren M.Farnworth on Nov. 22, 1994; U.S. Pat. No. 5,444,304 (the “'304 patent”),issued to Kouija Hara and Jun Tanabe on Aug. 22, 1995; U.S. Pat. No.5,450,289, issued to Yooung D. Kweon and Min C. An on Sep. 12, 1995;U.S. Pat. No. 5,451,815, issued to Norio Taniguchi et al. on Sep. 19,1995; U.S. Pat. No. 5,592,019, issued to Tetsuya Ueda et al. on Jan. 7,1997; and U.S. Pat. No. 5,635,760, issued to Toru Ishikawa on Jun. 3,1997.

The '794 patent discloses a vertical surface mount package having agull-wing, zig-zag, in-line lead configuration and a mechanism formounting the package to a printed circuit board (PCB) or other carriersubstrate. The force with which the package mounts to the carriersubstrate establishes a tight interference contact between the package'sleads and their corresponding terminals on the carrier substrate.

The '304 patent describes a vertical surface mount package which hasintegrally formed fins radiating therefrom. The fins of that devicefacilitate the dissipation of heat away from the device. Thesemiconductor device is electrically connected to the package's leads bywire bonding. The leads of that vertical surface mount package, whichextend therefrom in an in-line configuration, are mountable to theterminals of a carrier substrate by soldering.

However, many of the vertical surface mount packages in the prior artare somewhat undesirable from the standpoint that they permanentlyattach to a carrier substrate. Thus, those vertical surface mountpackages are not readily user-upgradable. Moreover, many prior artvertical surface mount packages include relatively long leads, whichtend to increase the impedance of the leads and reduce the overall speedof systems of which they are a part. Similarly, the wire bondingtypically used in many vertical surface mount packages increases theimpedance and reduces the overall speed of such devices. As the speed ofoperation of semiconductor devices increases, more heat is generated bythe semiconductor device, requiring greater heat transfer. Similarly, asthe speed of operation of semiconductor devices increases, decreasingthe length of the leads regarding circuitry connecting the semiconductordevice to other components and, thereby, decreasing the impedance of theleads to increase the responsiveness of the semiconductor device isimportant.

Thus, a need exists for a zero insertion force alignment device for bareor minimally packaged semiconductor devices which has low impedance andwhich facilitates the ready removal and reinstallation of thesemiconductor devices relative to a carrier substrate. An alignment andattachment device which transfers heat away from the vertical surfacemount package and establishes and maintains adequate electricalconnections between a vertical surface mount package and a carriersubstrate is also needed.

BRIEF SUMMARY OF THE INVENTION

The zero insertion force socket of the present invention addresses eachof the foregoing needs. The zero insertion force socket includesintermediate conductive elements which are configured to establish aninterference-type electrical connection with the bond pads of a bare orminimally packaged semiconductor device. An actuator moves a plate inthe socket to bias the intermediate conductive elements against the bondpads of a semiconductor device without rubbing against the semiconductordevice during insertion of the same into the socket.

In a first embodiment of the zero insertion force socket, the actuatormoves the plate transversely relative to the socket body to move theintermediate conductive elements into and out of contact with the bondpads of a semiconductor device that is interconnected with the socket.

In a second embodiment of the zero insertion force socket, the actuatormoves the plate vertically relative to the socket body in order toactuate movement of the intermediate conductive elements toward and awayfrom the bond pads.

A semiconductor device which is useful in connection with the zeroinsertion force socket of the present invention includes all of its bondpads along a single edge thereof.

The present invention also includes a method of securing a semiconductordevice substantially perpendicularly relative to a carrier substrate,and methods of designing and manufacturing vertically mountable baresemiconductor devices that are useful with the zero insertion forcesocket of the present invention. A computer with which the zeroinsertion force socket and the socket-semiconductor device assembly areassociated is also within the scope of the present invention.

Advantages of the present invention will become apparent to those ofordinary skill in the relevant art through a consideration of theappended drawings and the ensuing description.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is a perspective assembly view of a zero insertion force socketand semiconductor device assembly according to the present invention;

FIG. 2 is a frontal perspective view of a first embodiment of avertically mountable semiconductor device that is useful in the assemblyof FIG. 1;

FIG. 3 is a partial perspective view of a first embodiment of a zeroinsertion force socket according to the present invention, illustratinga transversely moveable actuator and omitting upper portions of thesocket;

FIG. 4a is an enlarged partial perspective view depicting theassociation of the transversely moveable actuator of FIG. 3 with theintermediate conductive elements of the zero insertion force socket,which are shown in a biased position;

FIG. 4b is an enlarged partial perspective view depicting theassociation of the transversely moveable actuator of FIG. 3 with theintermediate conductive elements of the zero insertion force socket,which are shown in an insertion position;

FIG. 5 is an enlarged partial perspective view depicting a variation ofthe transverse plate and intermediate conductive elements;

FIG. 6a is a partial perspective view depicting another variation of thetransverse plate and intermediate conductive elements;

FIG. 6b is a cross-section taken along line 6 b—6 b of FIG. 6a;

FIG. 7 is a cross-section taken along line 7—7 of FIG. 3, which depictsthe zero insertion force socket and a semiconductor deviceinterconnected therewith;

FIG. 8 is a partial perspective view of a second embodiment of a zeroinsertion force socket according to the present invention, illustratinga vertically moveable plate and omitting upper portions of the socket;

FIG. 9 is an enlarged partial perspective view depicting the associationof the vertically moveable actuator of FIG. 8 with the intermediateconductive elements of the zero insertion force socket;

FIG. 10 is an enlarged partial perspective view depicting a variation ofthe intermediate conductive elements of FIG. 8;

FIG. 11 is a cross-section taken along line 11—11 of FIG. 8, whichdepicts the zero insertion force socket and a semiconductor deviceinterconnected therewith;

FIG. 12 is a cross-sectional view of a variation of the secondembodiment of the zero insertion force socket;

FIG. 13 is a cross-sectional view of another variation of the secondembodiment of the zero insertion force socket;

FIGS. 14a and 14 b are enlarged partial perspective views depictinganother variation of the transverse plate and intermediate conductiveelements;

FIG. 14c is a cross-section taken along line 14 c—14 c of FIG. 14a,showing a socket which includes a plurality of cams; and

FIG. 15 is a schematic representation of the zero insertion force socketand an interconnected semiconductor device in a computer.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIG. 1, an assembly 1 is shown which includes a verticallymountable semiconductor device 10 and a zero insertion force socket 30.The zero insertion force socket, which is also referred to as socket 30,is attachable to a carrier substrate 70, such as a printed circuit board(PCB). Semiconductor device 10 is insertable into socket 30, which isalso referred to as a minimal insertion force socket, a reducedinsertion force socket, and is frequently referred to as a zeroinsertion force socket, which orients the semiconductor devicesubstantially perpendicularly relative to carrier substrate 70.

With reference to FIG. 2, semiconductor device 10 is a semiconductordevice of the type known in the industry, which includes circuit tracesand active elements. The bond pads 14 a, 14 b, 14 c, etc., ofsemiconductor device 10 are disposed on an active surface of the same,adjacent to a single edge 15 of the semiconductor device. Preferably,bond pads 14 a, 14 b, 14 c, etc., are arranged in-line. Bond pads 14 a,14 b, 14 c, etc., may be disposed a short distance from edge 15, ortheir lower edges may be flush with the edge. Thus, during fabricationof semiconductor device 10, bond pads 14 a, 14 b, 14 c, etc., areredirected to a location which is proximate edge 15. Processes which areknown to those of ordinary skill in the art are useful for manufacturingsemiconductor devices 10 which are useful in the assembly according tothe present invention. Such processes include the formation of circuittraces which lead to edge 15 and the fabrication of bond pads 14 a, 14b, 14 c, etc., adjacent to edge 15. Preferably, the fabrication stepswhich precede the formation of the circuit traces that lead to bond pads14 a, 14 b, 14 c, etc., and the formation of the bond pads are unchangedfrom their equivalent steps in the fabrication of prior artsemiconductor devices. Thus, existing semiconductor designs are usefulin the assembly of the present invention with little or no modification.

A preferred semiconductor device 10 has a standardized number of bondpads 14 a, 14 b, 14 c, etc., which are laterally spaced from one anotherat a standardized pitch, and which may be positioned at a specificlocation relative to a center line 22 of the semiconductor device, orrelative to any other landmark on the semiconductor device, such as aside thereof. Alternatively, the number and pitch of bond pads 14 a, 14b, 14 c, etc., may be non-standardized. The placement of bond pads 14 a,14 b, 14 c, etc., proximate edge 15 imparts semiconductor device 10 withreduced impedance as the bond pads are electrically connected to carriersubstrate 70, relative to many vertical surface mount packages and otherpackaged semiconductor devices in the prior art.

FIG. 3 illustrates a first embodiment of socket 30, which includes abody 32 including one or more receptacles 34 formed through the topthereof, a base 36, a transverse plate 38, which is also referred to asa member, positioned over the base and substantially parallel thereto,and intermediate conductive elements 60 extending upwardly through base36 and transverse plate 38.

Each receptacle 34 is an elongated opening that is defined by body 32and extends downwardly into socket 30. Receptacles 34 are eachconfigured to permit the insertion of a semiconductor device 10 (seeFIG. 2) therethrough and align the same relative to carrier substrate 70(see FIG. 1). Thus, in order to facilitate the insertion of asemiconductor device 10 into receptacle 34 and the proper alignment ofthe same relative to intermediate conductive elements 60, the dimensionsof each receptacle are preferably slightly larger than the correspondingdimensions of the semiconductor device to be inserted therein.

With continued reference to FIG. 3, transverse plate 38 is disposedabove base 36. Ends 39 and 41 of transverse plate 38 are disposed inslots 40 and 42, which are formed in surfaces 43 and 45, respectively,of body 32. Slots 40 and 42 engage ends 39 and 41, respectively, in amanner which facilitates lateral sliding of transverse plate 38 relativeto body 32. An actuator element 46 extends from end 41 of transverseplate 38, and through an elongated slot 44 formed through body 32. Thus,movement of actuator element 46 along slot 44 slides transverse plate 38relative to body 32. Slot 44 may also include member-position retentioncomponents 44 a and 44 b, which are referred to as retention componentsfor simplicity, and which facilitate the retention of the position oftransverse plate 38 relative to base 36.

Transverse plate 38 includes a series of mutually parallel members,which are referred to as arms 47, 48, that are joined by the sides 49 ofthe transverse plate 38. Each pair of adjacent arms 47 and 48 define adie slot 55 therebetween. With reference to FIGS. 4a and 4 b, arms 47each have a camming edge 51 a, which includes a series of distinct teeth52 extending therefrom, and an opposite edge 51 b located opposite thecamming edge. Each tooth 52 is tapered to define an insertion end 53 anda biasing end 54. Biasing end 54 is distanced further from opposite edge51 b than insertion end 53. Preferably, the number of teeth along eacharm 47 corresponds to the number of intermediate conductive elements 60extending adjacent thereto. Similarly, the length of teeth 52 along arm47 corresponds to the spacing between the laterally adjacentintermediate conductive elements 60 which correspond thereto.

As illustrated by FIG. 7, intermediate conductive elements 60 extendthrough base 36, into socket 30, and upward through die slot 55. Eachintermediate conductive element 60 is adjacent an arm 47 and proximatethereto. Each intermediate conductive element 60 is a resilient leafspring which includes a bond pad contact end 61 that faces away from thecorresponding arm 47, a segment 62 that is fixedly retained by base 36,and a terminal contact end 63 adjacent segment 62 and exposed throughthe bottom of the base. As illustrated, bond pad contact end 61 isconfigured to establish an electrical connection with a bumped bond pad.Terminal contact end 63 is electrically connected to a correspondingterminal 72 on carrier substrate 70. Each intermediate conductiveelement 60 is formed from a resilient, electrically conductive material,such as copper, nickel, or palladium. Preferably, each intermediateconductive element 60 has a length of about 1½ mm or less. Morepreferably, each intermediate conductive element 60 has a length ofabout 1 mm or less. As those in the art are aware, longer, larger wirescreate greater impedance. Thus, less impedance is generated by shorterintermediate conductive elements 60. The total length of eachintermediate conductive element 60 depends on the thickness of the baseof socket 30, the length required to establish an electrical connectionwith a terminal on the carrier substrate, and the length required toestablish an electrical connection with the bond pads of thesemiconductor device.

Turning now to FIG. 4a, the relationship between intermediate conductiveelement 60 and arm 47 is shown. Camming edge 51 a of arm 47 is biasedagainst intermediate conductive element 60. Specifically, eachintermediate conductive element 60 abuts a corresponding tooth 52. Sincesegment 62 (see FIG. 7) of each intermediate conductive element 60 isfixedly disposed within base 36 (see FIG. 7), as arm 47 is movedlaterally along slots 40 and 42 (see FIG. 3), movement of eachintermediate conductive element 60 along its corresponding tooth 52facilitates movement of the top end of the respective intermediateconductive element 60, which is referred to as a bond pad contact end61, in a direction that is substantially transverse to the movement ofarm 47. Bond pad contact end 61 faces away from its corresponding arm47. As depicted in FIG. 4a, arm 47 is in a biased position, whereinintermediate conductive element 60 is positioned adjacent to biasing end54 of tooth 52, which moves the intermediate conductive element awayfrom opposite edge 51 b. Thus, intermediate conductive element 60 hasbeen forced outward relative to arm 47.

FIG. 4b shows arm 47 in an insertion position, wherein intermediateconductive element 60 is positioned adjacent to insertion end 53 oftooth 52, which permits the intermediate conductive element to move backtoward opposite edge 51 b. Therefore, bond pad contact end 61 ofintermediate conductive element 60 may move into a die insertionposition (i.e., a position which facilitates the insertion of asemiconductor device 10 into socket 30).

Turning now to FIG. 5, a variation of the present embodiment of the zeroinsertion force socket is shown, wherein each of the elements issubstantially the same, with the following exceptions. Intermediateconductive elements 60′ are leaf springs which each include a bond padcontact end 61′ that faces toward arm 47′. Each arm 47′ includes teeth52′ on a camming edge 51 a′ thereof, and an opposite edge 51 b′ which islocated opposite the camming edge. Each of teeth 52′ is tapered todefine an insertion end 53′ and a biasing end 54′. Biasing end 54′ ofeach tooth 52′ is distanced further from opposite edge 51 b′ thaninsertion end 53′. Arm 47′ is also configured to support a semiconductordevice 10 (see FIG. 2). Thus, as intermediate conductive element 60′moves along tooth 52′ from biasing end 54′ to insertion end 53′, bondpad contact end 61′ moves toward opposite edge 51 b′ and toward asemiconductor device 10 supported by arm 47′.

FIGS. 6a and 6 b depict another variation of the first embodiment of thezero insertion force socket 30″, wherein the base 36″ of the socket,which is also referred to as a member, acts as the transverse plate andis, therefore, moveable transversely relative to the remainder of thesocket. Ends 39″ of base 36″ are disposed within slots 40″,respectively, that are formed in opposite sides of body 32″ and whichfacilitate the transverse movement of base 36″ relative to body 32″. Thearrows of FIG. 6b illustrate the directions that base 36″ moves relativeto body 32″. Actuator element 46″, which effects the movement of base36″ along slots 40″, extends from base 36″ and through a slot 44″ formedthrough body 32″. Intermediate conductive elements 60″ each include aterminal contact end 63″, which establishes an interference-typeelectrical contact with a corresponding terminal 72 of carrier substrate70, a segment 62″ that is fixedly retained by base 36″, and a bond padcontact end 61″. During transverse movement of base 36′ relative tosocket 30″, the terminal contact end 63″ of each intermediate conductiveelement 60′ slides along its respective terminal 72 to maintain itselectrical contact therewith, and each bond pad contact end 61″ movesrelative to its corresponding bond pad 14 of a semiconductor device 10inserted into the socket 30″. Thus, each bond pad contact end 61″ may beoriented in either a biased position, whereby it abuts and establishesan interference-type electrical contact with its corresponding bond pad14, or an insertion position, whereby it is moved outward to facilitateinsertion or removal of a semiconductor die 10 from socket 30″.

With reference to FIG. 1, socket 30 (as well as sockets 30′ and 30″ ofFIGS. 5, 6 a and 6 b) is manufactured from a material which maintainsits shape and rigidity at the relatively high temperatures that aregenerated during the operation of a semiconductor device. A socketmaterial which has good thermal conductivity properties and which may beformed into thin layers is also preferable. Materials including, withoutlimitation, copper, aluminum, ceramic, glass, FR-4 board, and injectionmolded plastics are useful for manufacturing socket 30.

Referring again to FIG. 7, as an example of the use of socket 30,actuator element 46 is positioned along slot 44 such that transverseplate 38 and, therefore, each intermediate conductive element 60, ismoved into an insertion position. A semiconductor device 10 is theninserted into receptacle 34 and through die insertion slot 55, so thatit rests upon base 36. Actuator element 46 is then positioned in slot 44to move transverse plate 38 and each intermediate conductive element 60to a biased position against its corresponding bond pad 14, whichestablishes an electrical connection between the bond pad 14 and itsrespective terminal 72 of carrier substrate 70.

With reference to FIG. 8, a second embodiment of a zero insertion forcesocket is shown, which is referred to as socket 130. Socket 130 includesa body 132, one or more receptacles 134 formed into the top of the body,a base 136, an ejector plate 138, which is also referred to as a member,disposed within the body above the base, and intermediate conductiveelements 160 extending upwardly through base 136 and ejector plate 138.

Each receptacle 134 is an elongated opening that extends downwardly intobody 132. Each receptacle 134 is configured to receive a semiconductordevice 10 (see FIG. 2) and align the same relative to a carriersubstrate 70 (see FIG. 1). Therefore, the dimensions of receptacle 134are slightly larger than the corresponding dimensions of semiconductordevice 10 so as to facilitate the insertion of the semiconductor devicethereinto and the proper alignment of the same with respect to carriersubstrate 70.

Still referring to FIG. 8, ejector plate 138 includes two ends 139 and141 that each include a plurality of fingers 139 a and 141 a (notshown), respectively, extending therefrom. Fingers 139 a and 141 a aredisposed within vertical guide slots 140 and 142 (not shown),respectively, that are formed in body 132. Slots 140 and 142 engagefingers 139 a and 141 a in a manner which facilitates vertical slidingof ejector plate 138 relative to body 132. An actuator element 146extends from end 141 of ejector plate 138, and through an elongatedvertical slot 144 that is formed through body 132. Thus, movement ofactuator element 146 along slot 144 slides ejector plate 138 verticallyrelative to body 132. Slots 140, 142, and 144 each include amember-position retention component 140 a, 142 a (not shown), and 145,respectively, which are each referred to as a retention component forsimplicity, and each of which are configured to retain ejector plate 138in an upper, insertion position. As illustrated, actuator element 146,fingers 139 a, 141 a and ejector plate 138 must be moved laterallyrelative to body 132 to retain the actuator element in retentioncomponent 145, the fingers in retention components 140 a, 142 a,respectively, and the ejector plate in the insertion position.

Ejector plate 138 includes a plurality of mutually parallel members,which are referred to as arms 147, 148, that are joined by the sides 149and 150 (not shown) of the ejector plate. Arms 147 are each configuredto support a semiconductor device 10 (see FIG. 11) disposed thereon.Alternatively, semiconductor device 10 may extend through an elongatedslot 155, defined by a pair of adjacent arms 147 or 147, 148 and restupon base 136. Intermediate conductive elements 160 extend upwardthrough elongated slot 155. Each arm 147 includes a camming edge 151,which abuts a camming section 164 of each of the correspondingintermediate conductive elements 160.

Referring now to FIG. 11, intermediate conductive element 160 is a leafspring which includes a bond pad contact end 161 at the top thereof andadjacent a camming section 164, which is located above a segment 162thereof that is fixedly retained within base 136. Intermediateconductive element 160 also includes a terminal contact end 163 thatextends from segment 162 and is exposed through the bottom of base 136.Terminal contact end 163 is electrically connected to a correspondingterminal 72 on carrier substrate 70. FIG. 9 illustrates an intermediateconductive element 160 which has a substantially flat camming section164 that extends diagonally toward its corresponding arm 147. Bond padcontact end 161 also extends toward the arm 147 that corresponds tointermediate conductive element 160. FIG. 10 illustrates a variation ofthe intermediate conductive element 160′, which includes a cammingsection 164′ that is concavely curved relative to the corresponding arm147. Thus, camming section 164′ extends upwardly toward arm 147. Bondpad contact end 161′ also extends toward arm 147. Preferably, eachintermediate conductive element 160, 160′ has a length of about 1½ mm orless. More preferably, each intermediate conductive element 160, 160 hasa length of about 1 mm or less.

With continued reference to FIGS. 9 and 10, as ejector plate 138 (seeFIG. 8) is moved upward relative to body 132 (see FIG. 8), camming edge151 slides upward along the camming section 164, 164′ of intermediateconductive element 160, 160′, biasing against the camming section andforcing the bond pad contact end 161, 161 away from arm 147. Thus,upward movement of ejector plate 138 places intermediate conductiveelement 160, 160′ into an insertion position. Similarly, as ejectorplate 138 is positioned downward relative to body 132, camming edge 151of arm 147 slides downward along camming section 164, 164′, permittingthe camming section to resiliently spring back to facilitate themovement of bond pad contact end 161, 161′ toward arm 147 and intoelectrical contact with a corresponding bond pad 14 (see FIG. 2) of asemiconductor device 10 (see FIG. 2) supported by arm 147. Thus,lowering of ejector plate 138 permits intermediate conductive elements160, 160′ to resiliently return to a biasing position.

With reference to FIG. 12, a variation of the second embodiment of thezero insertion force socket 130″ is depicted with the transverse plate138″ and intermediate conductive elements 160″ in a biased position,wherein each of the elements are substantially the same, with thefollowing exceptions. Intermediate conductive elements 160″ are leafsprings which each include a camming section 164″ and a bond pad contactend 161″, each of which extend away from arm 147″. Camming edge 151″abuts camming section 164″ and is positionable vertically relativethereto. As camming edge 151″ is moved upward along camming section164″, bond pad contact end 161″ is biased away from arm 147″ and towarda semiconductor device 10 disposed on the adjacent arm 147″. Uponmovement of ejector plate 138″ into an upper, biased position, bond padcontact end 161″ abuts its corresponding bond pad 14 to establish aninterference-type electrical contact therewith. The arrows illustratethe direction of movement of transverse plate 138″ to an insertionposition to facilitate placement of the intermediate conductive elements160″ into an insertion position.

FIG. 13 illustrates another variation of the second embodiment of zeroinsertion force socket 230 with the base 236 and the intermediateconductive elements 260 in an insertion position, wherein the base 236of the socket, which is also referred to as a member, also serves as theejector plate and is, therefore, moveable vertically relative to body232. The arrows illustrate the direction in which base 236 moves toplace it and the intermediate conductive elements 260 into a biasedposition. Intermediate conductive elements 260 extend through base 236and upwardly therefrom. Each intermediate conductive element 260includes a terminal contact end 263 which establishes aninterference-type electrical contact with a corresponding terminal 72 ofcarrier substrate 70, a segment 262 that is fixedly retained by base236, a camming section 264, and a bond pad contact end 261.

Socket 230 also includes one or more bias components 259 that extendtransversely across body 232. Each bias component 259 is positionedabove base 236 and abuts the camming sections 264 of each group ofintermediate conductive elements 260. The camming sections 264 areresiliently biased against bias component 259. Bond pad contact end 261extends away from bias component 259 and camming section 264 extendsupwardly toward bias component 259. As base 236 is moved upward, into aninsertion position, relative to body 232 and bias component 259,intermediate conductive elements 260 spring back toward theircorresponding bias component 259 and away from a semiconductor deviceadjacent thereto. Thus, as base 236 is moved downward relative to body232 and bias component 259 (i.e., into a biased position), the biascomponent forces bond pad contact end 261 away from the same and towarda semiconductor device 10 adjacent thereto. Upon lowering of base 236 toa biased position, the terminal contact end 263 of intermediateconductive element 260 contacts its corresponding terminal 72 toestablish an electrically conductive connection therewith. Thus, as base236 is moved into the biased position, an electrical connection iscreated between each terminal 72 and a corresponding bond pad 14 of asemiconductor device 10 disposed within socket 230.

With reference again to FIG. 8, socket 130″ (as well as sockets 130″ and230 of FIGS. 12 and 13) is manufactured from a material which maintainsits shape and rigidity at the relatively high temperatures that aregenerated during the operation of a semiconductor device. A socketmaterial which has good thermal conductivity properties and which may beformed into thin layers is also preferable. Materials including, withoutlimitation, copper, aluminum, ceramic, glass, FR-4 board, and injectionmolded plastics are useful for manufacturing socket 130.

Referring again to FIG. 11, as an example of the use of socket 130,actuator element 146 is positioned upward along slot 144 such thatejector plate 138 and, therefore, intermediate conductive elements 160,are moved into an insertion position. A semiconductor device 10 is theninserted into receptacle 134 so that it rests upon an arm 147 of ejectorplate 138. Actuator element 146 is moved in slot 144 to place ejectorplate 138 into a lowered, biased position (not shown). Thus,intermediate conductive elements 160 are also moved into a biasedposition to establish an electrical connection between bond pads 14 ofsemiconductor device 10 and their respective terminals 72 of carriersubstrate 70. Subsequent placement of ejector plate 138 in an insertionposition ejects at least a portion of each semiconductor device 10 fromits corresponding receptacle 134.

Referring now to FIGS. 14a through 14 c, a third embodiment of a zeroinsertion force socket is shown, which is referred to as socket 430.Socket 430 includes a cam 402 which, when rotated along an axis 404,actuates intermediate conductive elements 460 between a biased position(FIG. 14a) and an insertion position (FIG. 14b). As shown, cam 402 has acircular cross-section. Thus, in order for cam 402 to actuateintermediate conductive elements 460 between the insertion position andthe biased position, axis 404 must be off-center. In variations of cam402 which have non-circular cross-sections, however, axis 404 may extendcentrally through the cam. Cam 402 includes a camming surface 406 whichbiases against intermediate conductive elements 460 as the cam isrotated to a biased position. When cam 402 is rotated to the insertionposition, camming surface 406 rotates away from intermediate conductiveelements 460, permitting them to spring back to the insertion position.

Alternatively, cam 402 may be positioned on the opposite side ofintermediate conductive elements 460, such that when camming surface 406biases against the intermediate conductive elements, they are forcedaway from the bond pads 14 of a semiconductor device 10 that is disposedwithin socket 430. Rotation of cam 402 in the opposite direction permitsintermediate conductive elements 460 to resiliently bias against thebond pads 14 of semiconductor device 10.

In sockets 430 which include a plurality of cams 402, each of the camsmay be interconnected, such that they rotate in unison.

FIG. 15 illustrates a computer 300 including a carrier substrate 310.Socket 30 is secured to carrier substrate 310. Semiconductor device 10is insertable into socket 30, which establishes an electrical connectionbetween the semiconductor device and carrier substrate 310. Thus,semiconductor device 10 is operatively associated with computer 300.

Although the foregoing description contains many specificities, theseshould not be construed as limiting the scope of the present invention,but merely as providing illustrations of some of the presently preferredembodiments. Similarly, other embodiments of the invention may bedevised which do not depart from the spirit or scope of the presentinvention. The scope of the invention is, therefore, indicated andlimited only by the appended claims and their legal equivalents, ratherthan by the foregoing description. All additions, deletions andmodifications to the invention as disclosed herein which fall within themeaning and scope of the claims are embraced within their scope.

What is claimed is:
 1. A socket for orienting at least one semiconductordevice nonparallel relative to a substrate, comprising: at least onereceptacle for receiving at least a portion of the at least onesemiconductor device; at least one intermediate conductive elementwithin the at least one receptacle, the at least one intermediateconductive element being configured to establish electrical contact witha corresponding contact pad of the at least one semiconductor device;and at least one biasing member which is positionable so as to contactthe at least one intermediate conductive element and, when moved in adirection substantially parallel to a plane of the substrates positionsthe at least one intermediate conductive element in electrical contactwith the corresponding contact pad.
 2. The socket of claim 1, whereinthe at least one biasing member moves at least partially in a directionsubstantially perpendicular to a plane of the substrate.
 3. The socketof claim 1, wherein the at least one biasing member comprises arotatable cam.
 4. The socket of claim 3, wherein the rotatable camrotates about an off-center axis.
 5. The socket of claim 1, furthercomprising an actuator element associated with the at least one biasingmember so as to control movement of the at least one biasing member. 6.The socket of claim 5, further comprising a retention component formaintaining a position of the at least one biasing member.
 7. The socketof claim 1, wherein the at least one intermediate conductive elementcomprises a leaf spring.
 8. The socket of claim 1, wherein the at leastone biasing member is configured to force the at least one intermediateconductive element away from the corresponding contact pad of the atleast one semiconductor device.
 9. The socket of claim 1, wherein the atleast one biasing member is configured to at least partially support theat least one semiconductor device.
 10. The socket of claim 1, whereinthe at least one biasing member is configured to receive at least aportion of the at least one semiconductor device.
 11. The socket ofclaim 1, wherein the at least one biasing member is configured to atleast partially eject the at least one semiconductor device from the atleast one receptacle.
 12. A socket for orienting at least onesemiconductor device nonparallel relative to a substrate, comprising: atleast one receptacle for receiving at least a portion of the at leastone semiconductor device; at least one intermediate conductive elementwithin the at least one receptacle, the at least one intermediateconductive element being configured to electrically contact acorresponding contact pad of the at least one semiconductor device; andat least one biasing member for establishing electrical contact betweenthe at least one intermediate conductive element and the correspondingcontact pad, the at least one biasing member including a biasing edgefor contacting the at least one intermediate conductive element, the atleast one biasing edge comprising at least one tooth with a biasing endand an insertion end.
 13. The socket of claim 12, wherein the biasingend biases the at least one intermediate conductive element against thecorresponding contact pad of the at least one semiconductor devicewithin the at least one receptacle.
 14. The socket of claim 12, whereinthe insertion end facilitates the movement of the at least oneintermediate conductive element away from the corresponding contact padof the at least one semiconductor device within the at least onereceptacle.
 15. A socket for orienting at least one semiconductor devicenonparallel relative to a substrate, comprising: at least one receptaclefor receiving at least a portion of the at least one semiconductordevice; at least one intermediate conductive element within the at leastone receptacle and configured to electrically contact a correspondingcontact pad of the at least one semiconductor device; and at least onebiasing member for establishing electrical contact between the at leastone intermediate conductive element and the corresponding contact pad,the at least one biasing member being configured to at least partiallyeject the at least one semiconductor device from the at least onereceptacle.
 16. A socket for orienting at least one semiconductor devicenonparallel relative to a substrate, comprising: at least one receptaclefor receiving the at least one semiconductor device; at least oneintermediate conductive element within the at least one receptacle andconfigured to electrically contact a corresponding contact pad of the atleast one semiconductor device; and at least one biasing member forpositioning the intermediate conductive element against thecorresponding contact pad, the at least one biasing member beingconfigured to at least partially support the at least one semiconductordevice and to move at least partially in a direction substantiallyparallel to a plane of the substrate.
 17. A socket for orienting atleast one semiconductor device nonparallel relative to a substrate,comprising: at least one receptacle for receiving at least a portion ofthe at least one semiconductor device; at least one intermediateconductive element within the at least one receptacle and configured toestablish electrical contact with a corresponding contact pad of the atleast one semiconductor device; and at least one biasing member which ispositionable to contact the at least one intermediate conductiveelement, the at least one biasing member rotatable to position the atleast one intermediate conductive element in electrical contact with thecorresponding contact pad.
 18. The socket of claim 17, wherein the atleast one biasing member rotates about an off-center axis.
 19. Thesocket of claim 16, wherein the at least one biasing member isconfigured to bias the at least one intermediate conductive elementtoward the corresponding contact pad to establish the electricalcontact.
 20. The socket of claim 16, wherein the at least one biasingmember is configured to bias the at least one intermediate conductiveelement away from the corresponding contact pad.
 21. A socket fororienting at least one semiconductor device nonparallel relative to asubstrate, comprising: at least one receptacle for receiving at least aportion of the at least one semiconductor device; at least oneintermediate conductive element within the at least one receptacle, theat least one intermediate conductive element being configured toestablish electrical contact with a corresponding contact pad of the atleast one semiconductor device; and at least one biasing membercomprising a rotatable cam and which moves at least partially in adirection substantially parallel to a plane of the substrate to positionthe at least one intermediate conductive element in electrical contactwith the corresponding contact pad.
 22. A socket for orienting at leastone semiconductor device nonparallel relative to a substrate,comprising: at least one receptacle for receiving at least a portion ofthe at least one semiconductor device; at least one intermediateconductive element within the at least one receptacle, the at least oneintermediate conductive element being configured to establish electricalcontact with a corresponding contact pad of the at least onesemiconductor device; and at least one biasing member configured to atleast partially support the at least one semiconductor device and whichmoves at least partially in a direction substantially parallel to aplane of the substrate to position the at least one intermediateconductive element in electrical contact with the corresponding contactpad.
 23. A socket for orienting at least one semiconductor devicenonparallel relative to a substrate, comprising: at least one receptaclefor receiving at least a portion of the at least one semiconductordevice; at least one intermediate conductive element within the at leastone receptacle, the at least one intermediate conductive element beingconfigured to establish electrical contact with a corresponding contactpad of the at least one semiconductor device; and at least one biasingmember configured to receive at least a portion of the at least onesemiconductor device and which moves at least partially in a directionsubstantially parallel to a plane of the substrate to position the atleast one intermediate conductive element in electrical contact with thecorresponding contact pad.
 24. A socket for orienting at least onesemiconductor device nonparallel relative to a substrate, comprising: atleast one receptacle for receiving at least a portion of the at leastone semiconductor device; at least one intermediate conductive elementwithin the at least one receptacle, the at least one intermediateconductive element being configured to establish electrical contact witha corresponding contact pad of the at least one semiconductor device;and at least one biasing member configured to at least partially ejectthe at least one semiconductor device from the at least one receptacleand which moves at least partially in a direction substantially parallelto a plane of the substrate to position the at least one intermediateconductive element in electrical contact with the corresponding contactpad.